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FSC-BT1026D QCC3034 Bluetooth 5.1 TWS Audio Receiver Module

FSC-BT1026D is a dual-mode Bluetooth 5.1 aptX audio module based on the Qualcomm® QCC3034 chipset. It supports A2DP, AVRCP, HFP, HSP, SPP, GATT, HOGP, and PBAP profiles. Designed for high-end audio applications, it supports aptX, aptX HD, aptX Low Latency, SBC, and AAC audio codecs. FSC-BT1026D supports communicating with the FeasyBlue app and many other Bluetooth apps.

Features

  • Qualified Bluetooth® v5.1 specification
  • 120MHz Qualcomm® Kalimba™ audio DSP
  • 32MHz developer processor for applications
  • Firmware Processor for system
  • Flexible QSPI flash programmable platform
  • High-performance 24‑bit stereo audio interface
  • Digital and analog microphone interfaces
  • Flexible PIO controller and LED pins with PWM support
  • Supports UART, Bit Serializer (I²C/SPI), and USB 2.0 serial interfaces
  • Advanced audio algorithms
  • 1 or 2-mic Qualcomm@ cVc™ headset noise reduction and echo cancellation technology
  • Supports Qualcomm@ broadcast audio technology
  • Supports aptX, aptX HD, aptX Low Latency, SBC, and AAC audio codecs
  • Integrated PMU with dual SMPS for system/digital circuits and integrated Li-ion battery charger

Applications

  • Bluetooth stereo headsets/headphones
  • Qualcomm TrueWireless™ stereo earbuds

Specifications

Bluetooth Audio Module FSC-BT1026D
Chipset Qualcomm QCC3034
Bluetooth Standard Dual-mode Bluetooth 5.1
Size (mm) 13 × 26.9 × 2.2
Transmit Output Power +9 dBm (Max.)
Profiles A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT
Certifications CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC
Frequency Band 2.402~2.480GHz
Audio Codecs aptX, aptX HD, aptX Low Latency, SBC, AAC
Operating Temperature -40 °C to +85 °C
Storage Temperature -40 °C to +85 °C

Firmware

Firmware No. Application Profiles
FSC-BT1026D Audio & Data HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA
FSC-BT1026D Audio & Data Customization

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