Features
- Qualified Bluetooth® v5.1 specification
- 120MHz Qualcomm® Kalimba™ audio DSP
- 32MHz developer processor for applications
- Firmware Processor for system
- Flexible QSPI flash programmable platform
- High-performance 24‑bit stereo audio interface
- Digital and analog microphone interfaces
- Flexible PIO controller and LED pins with PWM support
- Supports UART, Bit Serializer (I²C/SPI), and USB 2.0 serial interfaces
- Advanced audio algorithms
- 1 or 2-mic Qualcomm@ cVc™ headset noise reduction and echo cancellation technology
- Supports Qualcomm@ broadcast audio technology
- Supports aptX, aptX HD, aptX Low Latency, SBC, and AAC audio codecs
- Integrated PMU with dual SMPS for system/digital circuits and integrated Li-ion battery charger
Applications
- Bluetooth stereo headsets/headphones
- Qualcomm TrueWireless™ stereo earbuds
Specifications
Bluetooth Audio Module | FSC-BT1026D |
---|---|
Chipset | Qualcomm QCC3034 |
Bluetooth Standard | Dual-mode Bluetooth 5.1 |
Size (mm) | 13 × 26.9 × 2.2 |
Transmit Output Power | +9 dBm (Max.) |
Profiles | A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT |
Certifications | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
Frequency Band | 2.402~2.480GHz |
Audio Codecs | aptX, aptX HD, aptX Low Latency, SBC, AAC |
Operating Temperature | -40 °C to +85 °C |
Storage Temperature | -40 °C to +85 °C |
Firmware
Firmware No. | Application | Profiles |
---|---|---|
FSC-BT1026D | Audio & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
FSC-BT1026D | Audio & Data | Customization |