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FSC-BW1501UV Wi-Fi 6 + BT 5.4 Automotive Level Module

BW1501UV is a highly integrated single chip which features a low power 2x2 802.11a/b/g/n/ac/ax dual-band Wi-Fi subsystem and a Bluetooth v5.4 subsystem, offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance.

Optimized RF architecture and baseband algorithms provide superb performance and low power consumption. Intelligent MAC design deploys a high-efficiency offload engine and hardware data processing accelerators which fully offload Wi-Fi tasks from the host processor. BW1501UV is designed to support standard-based features in the areas of security, quality of service, and international regulations, giving end users the greatest performance at any time and under any circumstance.

BW1501UV is designed to support high data throughput over Wi-Fi. The host interface PCIe 2.1 is integrated to provide stable bandwidth between the host platform and BW1501UV. The clock rate of the internal bus fabric can also support the throughput requirement. The clock rate of the MCU is also configurable for different kinds of scenarios.

BW1501UV supports low power requirements. Multiple power domains are implemented on the chip. It defines a deep sleep mode, in which only the AON domain is powered on, while other OFF domains are shut off by the power switches integrated on the chip. In deep sleep mode, the PMU could be further configured to be in a low power state to save power consumption.

BW1501UV has the Wi-Fi MAC, BBP, and the RF subsystems, which provide the best-in-class radio and low power performance.

BW1501UV has the Bluetooth LC/BB and the RF subsystems.

General Features

  • 32-bit RISC MCU for Wi-Fi/Bluetooth protocols and Wi-Fi
  • BT & Wi-Fi 4GHz built-in BAW filter
  • Embedded SRAM/ROM
  • USB interface with hardware flow
  • Programmable and multiplexed GPIO
  • PCIe device fully compliant to PCIe 1 specification
  • Advanced FDD/TDD mode Wi-Fi/Bluetooth coexistence
  • Integrated 20Kbit eFuse to store device-specific information and RF calibration

WLAN Features

  • IEEE 11a/b/g/n/ac/ax compliant
  • Support 20MHz, 40MHz, 80MHz bandwidth in 4GHz, 5GHz, 6GHz band
  • Dual-band 2T2R
  • Support MU-MIMO
  • Support uplink MU-OFDMA TX and downlink MU-OFDMA
  • Support DBDC (dual band dual concurrent)
  • Support STBC, LDPC, TX Beamformer, and RX Beamformer
  • Greenfield, mixed mode, legacy modes
  • IEEE 11d/e/h/i/j/k/mc/r/v/w support
  • Security support for WFA WPA/WPA2/WPA3 WPS 2.0
  • QoS support of WFA WMM, WMM
  • Integrated LNA, PA, and T/R
  • Optional external LNA and PA
  • Interface: Data rate up to 1024Mbps

Bluetooth Features

  • Bluetooth 4 with BLE (BT low energy)
  • Supports BT/BLE dual
  • Supports BT/Wi-Fi coexistence
  • Supports 7 BT links and 16 BLE links
  • Supports SCO and eSCO link with re-transmissions
  • Supports wide-band speech
  • Supports mSBC and SBC including mono and stereo audio
  • Supports Packet Loss Concealment (PLC) function for better voice quality
  • Supports LE Isochronous Channels
  • Supports LC3 including mono and stereo modes
  • Supports secure connection with AES128 encryption
  • Channel quality-driven data rate adjustments
  • Channel assessment and WB RSSI for better performance


Specifications

Categories Features Implementation
Bluetooth    
Bluetooth Standard Support Bluetooth 5.4 + EDR  
Frequency Band 2.402G ~ 2.480G  
Interface UART, PCM/I2S  
RF Input Impedance 50 ohms  
WLAN    
Frequency Band 2.4GHz/5GHz/6GHz  
RF Input Impedance 50 ohms  
Interfaces PCIe  
Operate Condition    
VDDIO 1.8V  
VDD8/27/2024_3V3 3.3V  
Operating Temperature -40°C to +85°C  
Storage Temperature -40°C to +125°C  
Humidity 10% ~ 90% Non-Condensing  
Dimension    
Dimension 23mm(L) × 23mm(W) × 3.0mm(H)  
Weight TBD  
Coplanarity <= 0.1mm (ordinary temperature 25°C)  
ROHS ROHS 2.0  

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