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FSC-BW1501UV Wi-Fi 6 + BT 5.4 Module

BW1501UV is a highly integrated single chip which features a low power 2x2 802.1 1a/b/g/n/ac/ax dual-band Wi-Fi subsystem and a Bluetooth v5.4 subsystem, offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance.

Optimized RF architecture and baseband algorithms provide superb performance and low power consumption. Intelligent MAC design deploys a high efficient offload engine and hardware data processing accelerators which fully offloads Wi-Fi task of the host processor. BW1501UV is designed to support standard based features in the areas of security, quality of service and international regulations giving end users the greatest performance any time and in any circumstance.

BW1501UV is designed to support high data throughput over Wi-Fi. The host interface PCle2.1 is integrated to provide stable bandwidth between the host platform and BW1501UV. The clock rate of the internal bus fabric can also support the throughput the requirement. The clock rate of MCU is also configurable for different kinds of scenarios.

BW1501UV supports low power requirement. Multiple power domains are implemented on chip. It defines a deep sleep mode, in which only the AON domain is powered on, while other OFF domains are shut off by the power switches integrated on chip. In deep sleep mode, the PMU could be further configured to be in a low power state to save the power consumption.

BW1501UV has the Wi-Fi MAC, BBP, and the RF subsystems, which provide the best-in-class radio and low power performance.

BW1501UV has the Bluetooth LC/BB and the RF subsystems.

General Features

  • 32-bitRISC MCU for Wi-Fi/Bluetooth protocols and Wi-Fi 
  • BT& Wi-Fi 4GHz built in BAW filter.
  • EmbeddedSRAM/ROM.
  • USBinterface with hardware flow 
  • Programmableand multiplexed GPlO 
  • PCIedevice fully compliant to PCIe 1 specification.
  • AdvancedFDD/TDD mode Wi-Fi/Bluetooth coexistence 
  • Integrate20Kbit efuse to store devices specific information and RF calibration 

WLAN Features

  • IEEE11 a/b/g/n/ac/ax compliant.
  • Support20MHz, 40MHz, 80Mhz bandwidth in 4GHz, 5GHz, 6GHz band.
  • Dual-band2T2R 
  • SupportMU-MIMO 
  • Supportuplink MU-OFDMA TX and downlink MU-OFDMA
  • SupportDBDC (dual band dual concurrent).
  • SupportSTBC, LDPC, TX Beamformer and RX Beamformer
  • Greenfield,mixed mode, legacy modes 
  • IEEE11 d/e/h/i/j/k/mc/r/v/w support.
  • Securitysupport for WFA WPA/WPA2/WPA3  WPS2.0.
  • QoSsupport of WFA WMM, WMM
  • IntegratedLNA, PA, and T/R 
  • Optionalexternal LNA and PA 
  • Interface:1 Data rate up to 1024Mbps.

Bluetooth Features

  • Bluetooth4 with BLE (BT low energy).
  • SupportsBT/BLE dual 
  • SupportsBT/Wi-Fi 
  • Supports7 BT links and 16 BLE
  • SupportsSCO and eSCO link with re-
  • Supportswide-band 
  • SupportsmSBC and SBC including mono and 
  • SupportsPacket Loss Concealment (PLC) function for better voice 
  • SupportsLE Isochronous 
  • SupportsLC3 including mono and 
  • Supportssecure connection with AES128 and 
  • Channelquality driven data rate 
  • Channelassessment and WB RSSI for 

 

Specifications

Categories

Features

Implementation

Bluetooth

 

 

 

Bluetooth Standard

Support Bluetooth 5.4+EDR

 

Frequency Band

2.402G ~ 2.480G

 

Interface

UART, PCM/I2S

 

RF Input Impedance

50 ohms

WLAN

 

 

 

Frequency Band

2.4GHz/5GHz/6GHz

 

RF Input Impedance

50 ohms

 

Interfaces

PCIE

operate condition

 

 

 

VDDIO

1.8V

 

VDD8/27/2024_3V3

3.3V

 

Operating Temperature

-40°C to +85°C

 

Storage temperature

-40°C to +125°C

 

Humidity

10%~90% Non-Condensing

Dimension

 

 

 

Dimension

23mm(L)*23mm(W)*3.0mm(H)

 

weight

TBD

 

coplanarity

<=0.1mm (ordinary temperature 25°C

 

ROHS

ROHS2.0

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