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FSC-BW1001UV QCA6688 Wi-Fi 6 + BT 5.3 Module

FSC-BW1001UV module integrates WLAN/BT/BLE in a single package module which support 802.11ax Wi-Fi 6Eand Bluetooth (BT) v5.3. The Module is based on QCA6688 chipset of Qualcomm, the module which uses the 112pins (around 76pins, bottom pads 36pins) 23mm*23mm LGA package and it can be used for high-speed wireless connectivity of automotive information and entertainment systems.

WLAN Features
  • Supports1la/b/g/n/ac/ax wi-Fi6e compliant;
  • Supports2x2 Multi-User Multiple-Input Multiple-Output (MU-MIMO)
  • 20MHz/40 MHz channel bandwidth for 4 GHz
  • DynamicFrequency Selection (DFS, radar detection)Offloading traffic for minimal host utilization at 11ac/ax speeds
  • PCIEGen 3
  • Low-powerPCIE (with L1 substate) interface
  • Integratedclose-loop power detector
Bluetooth Features
  • Compliantwith Bluetooth 3Supports LE Audio
  • Supports2 Mbps Bluetooth Low Energy (BLE), BLE long range
  • SplitACL support for A2DP true stereo (earbuds)Dedicated Bluetooth antenna, sharing Bluetooth antenna with WLAN, and concurrent with 5G WLAN Dual eSCO/A2DP streams
  • Supportsclass 1 and class 2 power-level transmissions without requiring an external power amplifier (PA)Backward-compatible with previous Bluetooth standards
  • Flexibleinterface UART/PCM/l2S for Bluetooth audio
Specifications

Categories

Features

Implementation

Bluetooth

  
 

Bluetooth Standard

Support Bluetooth 5.3

 

Frequency Band

2.402GHz ~ 2.480GHz

 

RF Input Impedance

50 ohms

 

Interface

UART, PCM/I2S

 

Antenna

External

 

Support mode

Slave and Master

 

Profiles

HFP/A2DP/AVRCP/PBAP/SPP/PAN/FTP/OPP/GATT/IAP2/ANCS/HID

 

Maximum throughput

2,3Mbps

WLAN

  
 

Wi-Fi feature

2.4GHz: IEEE802.11 b/g/n radio 5GHz: IEEE802.11 a/n/ac/ax radio

 

Frequency Band

2.4GHz /5GHz/6GHz

 

RF Input Impedance

50 ohms

 

Interface

PCIE

 

Antenna

External

 

Profiles

AP/Station/P2P

 

Security

WAPI STA,WPA,WPA2,AES,TKIP,WPA3

operate condition

 

VDD_CORE_VL

0.95V

 

VDD_CORE_VM

1.35V

 

VDD_CORE_VH

1.9V

 

VDD_PA

3.8V

 

VDD18_IO

1.8V

 

Temperature

-40°C to +85°C

 

Humidity

10%~90% Non-Condensing

Dimension

  
 

Dimension

23mm(L)*23mm(W)*2.9mm(H)

   

ROHS

  
 

PCB Warpage

<0.5%(0.162mm)

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